The Capital Region has become an epicenter for research and manufacturing of so-called 3D, or stackable, computer chips, a ...

By Max A. Cherney SAN JOSE, California, Feb 26 (Reuters) - Artificial intelligence chip designer Broadcom said that it expects to sell at least 1 million chips by 2027 based on its stacked design tech ...

Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...

Broadcom (AVGO) said that it expects to sell at least 1M chips by 2027 based on its stacked design technology.

Funding from the U.S. National Science Foundation is part of a broader push to propel domestic computer chip manufacturing A $3 million grant from the U.S. National Science Foundation (NSF) to the ...