The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...
Ball grid array (BGA) reworking typically involves de-soldering and resoldering the chip to remove defective components and mount new ones. However, it’s a complex task, and people can easily make ...
The SG-BGA-7064 chip socket accommodates 0.75-mm-pitch ICs with 7.286 x 10.85-mm-footprints. The devices operate in excess in 10 GHz and support dense 48-ball BGA stacked devices using ...
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