NEW YORK--(BUSINESS WIRE)--Olaplex Holdings, Inc. (“OLAPLEX”), the innovative, science-enabled, and technology-driven haircare company, today announced the launch of the brand’s new patented OLAPLEX ...

SAN JOSE, Calif., June 12, 2024 (GLOBE NEWSWIRE) -- Today, Adeia Inc. (Nasdaq: ADEA), a leading R&D and intellectual property (IP) licensing company known for bringing leading innovations in the ...

A new technical paper titled “Thermal stability enhancement of low temperature Cu-Cu bonding using metal passivation ...

TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes possible the ...

Samsung Electronics and SK hynix are considering adopting hybrid bonding technology for next-generation high-bandwidth memory (HBM), a move expected to reshape the global semiconductor equipment ...

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory stack. A JEDEC move made that unnecessary with this generation, but it’s ...

This blog post takes a practical look at improving strength and performance of protective body armor. With ultrasonic ...

Medical Manufacturing Technologies has acquired Innova Design, expanding its foothold in the bonding technologies industry. Innova Design specializes in laser bonding industry innovations, and ...

Adeia has filed a pair of patent infringement lawsuits against AMD in the U.S. District Court for the Western District of Texas, claiming that AMD’s chips incorporate patented innovations covered by ...

- Contributing to the advancement of photonics-electronics convergence technology and working with partners for early commercialization - TOKYO--(BUSINESS WIRE)-- OKI (TOKYO: 6703) has successfully ...