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To allow real-time control of dielectric chemical mechanical planarization (CMP) processes to the 45 nm device node and beyond, Santa Clara, Calif.-based semiconductor manufacturing equipment leader ...

For decades, semiconductor manufacturers have used chemical-mechanical polishing (CMP) as the primary technique for the smoothing and leveling (planarization) of dielectrics and metal layers. CMP ...

The semiconductor industry is constantly marching toward thinner films and complex geometries with smaller dimensions, as well as newer materials. The number of chemical mechanical planarization (CMP) ...

DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/n63tp6/cmp_consumables) has announced the addition of the "CMP Consumables ...

Electronic and computer processors with a higher speed need smaller features for integrated circuits (IC), which also need smoother and smaller substrate surfaces. Chemical mechanical polishing (CMP) ...

NuTool Inc. today introduced a copper chemical mechanical planarization (CMP) process using fixed abrasive for copper polish on Ultra Low-k dielectrics. The polishing process, which demonstrated a ...

Chemical Mechanical Planarization (CMP) is a critical process in the semiconductor, LED wafer, and hard disk manufacturing industry and is used to achieve the substrate wafer's required planarity.

Suppliers of chemical mechanical planarization (CMP) slurries may be fierce competitors of Cabot Microelectronics, the company considered to be the sector's number one player, but they agree with the ...

CMP is an integral part of the semiconductor chip manufacturing process enhancement process. Since the concept of CMP polishing applications was introduced by Walsh et al. in 1965, CMP process ...