Die attach materials form the cornerstone of reliable power electronic packaging, providing the essential bond between semiconductor devices and their substrates. Recent advances have focused on ...
QPT just filed a patent for the “qAttach” process, a novel way to attach dies to heat spreaders or substrates (typically aluminum nitride (AlN)) that significantly reduces thermal resistance. The new ...
The DA-5045-2 and DA-5045-4 high-thermal-conductivity die-attach adhesives for attaching LEDs and small die are engineered to withstand JEDEC level 1/ 260°C reliability standards in LED packaging ...
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