Designed for nanometer-scale silicon ICs, a new wire-bond chip-packaging process–called Pad on I/O–by chip manufacturer LSI Logic (Milpitas, CA) places bond pads directly on active copper/low-K ...

Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. To ...

The semiconductor equipment industry has witnessed a gradual increase in the proportion of packaging and testing equipment, with the continuous advancement of advanced packaging. Die bonding plays a ...