Feb. 21, 2024 — EDA software company Cadence and Intel Foundry have collaborated to develop an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to ...
The terms “chiplet” and “heterogeneous integration” fill news pages, conference papers, and marketing presentations, and for the most part engineers understand what they’re reading. But speakers ...
The miniaturization trend in electronic devices and the rise in smart and IoT device segments make adopting heterogeneous integration of chip components or 3D-ICs a viable option for miniaturization ...
TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes possible the ...
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