Master Bond EP54TC—is engineered for critical thermal management applications, featuring the highest thermal conductivity.

Infused with nanosilica, this two-component epoxy system from Master Bond is suitable for potting, coating and sealing applications. EP114’s nanoparticles are designed for dimensional stability, ...

The epoxy has a forgiving cure ratio which can be varied for more rigidity or better impact resistance. EP21LV two-part epoxy conforms to USP Class VI and Title 21, U.S. Code of Federal Regulations, ...

December 19, 2025 - Hackensack, NJ - Master Bond Supreme 10HTLV is a one part, non-frozen, heat cured epoxy formulated for demanding structural bonding applications. This toughened system features a ...

Master Bond EP3HTSDA-2Med is a true one component epoxy that is not pre-mixed and frozen. It offers an easy dispensing profile with an exceptionally long working life at room temperature, making it ...

The Master Bond EP21TDC-4 is a room temperature curing two part epoxy system that features high peel strength. This highly flexible epoxy is intended for high performance bonding, sealing and coating ...

For applications demanding exceptional chemical resistance, especially to acids, fuels, and oils, Master Bond has developed EP21AR. Whether coating, lining, bonding or sealing, this two-component ...

Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. Forumlated to serve as a damming compound, the thixotropic paste material can also be utilized for bonding and sealing.