Adhesion won't be a problem, cohesion within the chip is a more important factor as chips aren't designed to withstand any forces in the direction a heatsink would apply. If the sink will fall off you ...
The EP21FL two-part epoxy-resin system features low to moderate viscosity and is suitable for potting, coating, and sealing electronic assemblies. It is said to excel at bonding dissimilar substrates ...
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