The tool aims to ease the challenges of designing intricate 3D interconnects, offering engineers a way to handle multi-die ...
Keysight Technologies has introduced a new software tool aimed at tackling the growing complexity of 3D interconnect design ...
Keysight Technologies, Inc. (NYSE: KEYS) today introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The solution addresses the mounting complexity ...
The Keysight Chiplet 3D Interconnect Designer automates the design of 3D interconnects for chiplet and 3DIC advanced packages ...
Surge in Digital Transformation Drives Demand for High-Speed Data Center Interconnects; Enterprises Embrace 400G/800G Optical Solutions for Low-Latency and Secure Transfers Amid AI and Hybrid Cloud ...
One of the unsung workhorses of modern technology is the humble interconnect. This is essentially a wire or set of wires that link one part of an electronic system to another. In ordinary silicon ...
PLEASANTON, CA, UNITED STATES, February 10, 2026 /EINPresswire.com/ -- Inneos today announced Cheetah, a ruggedized ...
Qualcomm outlined the technology challenges facing mobile chip suppliers at a recent event. In no particular order, the challenges include the usual suspects—area scaling, power reduction, performance ...
Smiths Interconnect’s high-power burn-in socket is a specialized electromechanical interface designed to temporarily connect a semiconductor device (like a CPU, GPU, AI accelerator or high-power ...
Smiths Interconnect, a leading provider of innovative solutions for critical semiconductor test applications, and a business of Smiths Group, is pleased to announce that its patented, state-of-the-art ...
In our previous blog, we mentioned that verifying an NoC system goes far beyond transaction route checking. We were able to catch various issues during a complex interconnect verification at SoC level ...
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