TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames ...

Dai Nippon Printing Co (DNP) has developed a new lead frame in response to efforts to slim down the semiconductor package mounted on electronic devices, including mobile terminals and PCs. Using this ...

Pune,India, Feb. 16, 2023 (GLOBE NEWSWIRE) -- The global Semiconductor Lead Frame Market Size was assessed at USD 3.18 billion in 2021. The market is slated to expand from USD 3.33 billion in 2022 to ...

This family of lead-frame packages has been extended to include dual-sided units. Said to combine the performance of array packages with the lower cost of lead frames, the dual, fine-pitch, no-lead ...

A common type of chip package that uses metal leads that extend outside the housing. Lead frame technology goes back to the early days of DIP chips, but is still widely used in many package varieties.

DNP has taken advantage of our microfabrication technology developed over many years to successfully achieve the configuration of lead frame silver plated area of ±25um. It has also been possible to ...

Dai Nippon Printing Co (DNP) has developed a new lead frame in response to efforts to slim down the semiconductor package mounted on electronic devices, including mobile terminals and PCs. Using this ...