Polymers are a popular material for everyday objects and have many industrial applications, with their use increasing rapidly. However, for new polymers to be developed and commercialized is often a ...
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The rise of 3D integrated circuits (ICs) and heterogeneous packaging is reshaping how automotive ICs fulfill demanding analog and sensor requirements. Whether for ...
The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...
Companies integrating multiple chips or chiplets into a package will need to address structural and other mechanical engineering issues, but gaps in the design tools, new materials and interconnect ...
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