Fan-out panel-level packaging (FOPLP) promises to significantly lower assembly costs over fan-out wafer-level packaging, providing the relevant processes for die placement, molding and redistribution ...
When composite freight trailer manufacturer Composittrailer (Lokeren, Belgium) tried to locate a supplier of strong, impact-resistant structural sidewall and floor panels for its heavy-duty, ...
Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel ...
Italian startup 9-tech is developing a thermomechanical recycling process for end-of-life PV panels. Early results show an 87% recovery yield for materials like silicon, copper, and silver, with ...
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