Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

While RPA is meeting some automation needs, agencies are also looking to advanced technologies, including artificial intelligence, to solve more complicated process challenges. Alexander Slagg is a ...

The advanced packaging architecture designed for AI and high-performance computing (HPC) applications involves positioning memory in close proximity to AI processors, such as GPUs and AI ASICs, on a ...

Organizations are always looking for ways to enhance operations, boost productivity and maximize impact. Process innovation—the practice of leveraging technology and human ingenuity to dramatically ...