One new and different item laid out in the Evaluation of Corporate Compliance Program (Evaluation), supplementing the Ten Hallmarks of an Effective Compliance Program from the 2012 FCPA Guidance, was ...
The 2023 ECCP re-emphasized the need for both performing a root cause analysis but equally importantly using it to remediate your compliance program. It stated, “a hallmark of a compliance program ...
Getting to the root cause is not always that straightforward. Businesses are using increasingly complex items of equipment like robotics, for example. Even something that is largely done by humans can ...
Two expectations informed end-users have of electric motor service centers are reliable best practice repairs and root cause failure analysis (RCFA) to prevent recurring failures. Service centers ...
Not all root cause analysis is equally effective or reliable. Many root cause systems operate as standalone modules, without helping investigators collect accurate information. In the TapRooT® 7-Step ...
At some point, your PPC performance will take a nose-dive. Once you’ve managed PPC campaigns long enough, you will likely navigate numerous crises. Pinpointing the source of a specific issue can be ...
When there’s a major systems outage or performance issue, IT teams come to the rescue to restore services as quickly as possible. Some IT organizations follow IT service management (ITSM) incident ...
Editor’s note: This article is the second in a series to help practitioners learn about the AICPA’s new quality management standards and prepare to implement them. The interrelated final standards on ...
Nothing is more frustrating for a fleet than bringing a truck back to a shop for a recurring problem. Given the cost of downtime, fleets expect repairs to be made correctly the first time. Yet, there ...
Expertise from Forbes Councils members, operated under license. Opinions expressed are those of the author. Every organization should have a computer incident response plan. A solid plan should serve ...
The semiconductor industry is undergoing a profound transformation. What once centered on single-die silicon packaged in QFN or BGA formats has evolved into a landscape of multi-die integration, ...
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