This paper will address the optimization of Pb Free soldering conditions, with a focus on differences between Sn/ Pb and Pb Free soldering. This allows assemblers to build on their extensive ...
The solders used in the Electronic Industry are rapidly changing from Tin/Lead (Sn/Pb) solders to Lead-Free (Pb-Free) solders to meet new environmental and Green requirements. Many of these ...
Discrete electronic components such as resistors, capacitors and even larger IC's are shrinking down smaller every year, and that makes it harder for the average home maker or hobbyist to create their ...
[Sebastian] needed a small solder oven so he bought himself a small toaster oven (Spanish, Google Translate). It’s not the kind of thing we’d make our breakfast in now, but for soldering it’s a very ...
There are almost as many ways to reflow a surface-mount circuit board as there are hackers. Today, we add another method to the list. [Dasaki] converted a halogen floodlight into an SMT oven, and did ...
LINCOLN, R.I.--(BUSINESS WIRE)--Aug. 8, 2006--The Solder Paste Group of EFD, Inc. and Leister Technologies LLC have agreed to a cooperative marketing effort for a unique, high-speed, high-precision, ...
This video describes Digicom’s solder reflow services. The advanced high-throughput convection reflow oven from Digicom produces customized time-temperature profiles for each board. A gold super-mold ...
Capable of withstanding 260ûC peak solder reflow conditions while meeting JEDED Level-3 standards, Hysol FP4453 dam-and-fill encapsulant is a black, high-viscosity liquid that provides minimum flow ...
This is somewhat Mac related, but I think it's more of a chip issue (esp on factory-assembled boards), so I figured I'd post here. Basically, I'm having repeated failures of an ATI 4850 graphics card ...
YES Delivers Multiple VeroTherm Formic Acid Reflow Systems To Leading Semiconductor Device Customers
FREMONT, Calif., June 26, 2024 /PRNewswire/ -- YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging applications, today announced ...
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