Amidst arrivals of proprietary, internal through-silicon-via (TSV) interconnect solutions by STMicroelectronics and Aptina Imaging (a Micron Technology arm dedicated to imaging and wafer-level cameras ...
SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has developed the industry's first 12-layer 3D-TSV ...
From large TSVs for MEMS to nanoTSVs for backside power delivery, cost-effective process flows for these interconnects are essential for making 2.5D and 3D packages more feasible. Through-silicon vias ...
SEOUL, Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the development of 32 gigabyte (GB) double data rate-3 (DDR3) registered ...
SUNNYVALE, Calif.--(BUSINESS WIRE)-- Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today ...
New materials and systems enable chipmakers to increase the performance and reliability of hybrid bonding, the industry’s most advanced interconnect technology New deposition systems improve the ...
The AI boom has fueled the high-performance semiconductor market. SK Hynix, in light of investment reduction, has elected to expand its HBM technology capabilities through recent allocations of ...
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