Chicago, Dec. 11, 2025 (GLOBE NEWSWIRE) -- The global wafer dicing services market was valued at US$ 617.5 million in 2025 and is projected to exceed valuation of US$ 932.9 million by 2035 at a CAGR ...
How Does Fonon BlackStar Maximize Wafer Dicing Yield? Fonon Corporation’s laser-powered BlackStar Wafer Dicing System helps semiconductor fabricators eliminate defects, distortions, cracks and ...
Cleaving is a fast and simple method used for preparing samples of semiconductor materials, including silicon. In contrast, sapphire does not cleave well, despite being a single crystal. While sawing ...
Manufacturing of semiconductor chips involves cutting the wafers, first: The process is known as wafer dicing and produces “chips” or “die”. Typical challenges in wafer dicing applications include ...
Advances in laser grooving means that manufacturers are able to optimize die separation quality by combining traditional blade dicing and laser grooving techniques to separate individual chips from ...
(MENAFN- GlobeNewsWire - Nasdaq) The market currently experiences rapid technological bifurcation where mechanical methods handle standard output while advanced laser solutions address the burgeoning ...
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