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Wolfspeed produces single crystal 300mm silicon carbide wafer

The 300mm silicon carbide wafer targets higher production capacity for power electronics and advanced system integration.
Nasdaq

ACM Research Highlights Availability of Portfolio of Wafer-Level Packaging Processing Equipment for OSAT Customers

Extensive Array of Back-End and Advanced Packaging Wet Wafer Process Equipment Leverages ACM’s Experience to Address Emerging Requirements for Wafer-Level Packaging FREMONT, Calif., Oct. 15, 2020 ...
Nasdaq

ClassOne Technology Delivers First Solstice® S4 Single-Wafer Processing System to Analog Devices

KALISPELL, Mont., June 27, 2024 (GLOBE NEWSWIRE) -- ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today ...
Electronics360

Boosting productivity in semiconductor manufacturing with new film-thickness measurement system

Hamamatsu Photonics has developed the HyperGauge thickness measurement system C17319-11, a new device designed to enhance ...
VentureBeat

Cerebras’ wafer-size chip is 10,000 times faster than a GPU

Cerebras Systems and the federal Department of Energy’s National Energy Technology Laboratory today announced that the company’s CS-1 system is more than 10,000 times faster than a graphics processing ...
EDN

3-D wafer process combines benefits of Si, GaAs, InP

Semiconductor manufacturer Xanoptix (Merrimack, NH) has developed a wafer-scale process for the 3-D stacking of silicon with either GaAs or InP to make compound semiconductors. The company's Hybrid ...
Digi Times

Boosting both capacity and yield, iST offers complete backend wafer process services for power semiconductor devices

Power consumption is a crucial consideration for all types of electronics. As critical power components used in a wide range of electronic products, power MOSFET and other types of power semiconductor ...
pv magazine International

Upgrades needed to process larger wafers, says VDMA

In an update to its International Technology Roadmap for Photovoltaics, German engineering association the VDMA notes standardization of wafer size is a topic of great interest to the country’s PV ...
Digi Times

PSI rules out China for new wafer processing fab site

Taiwan-based Phoenix Silicon International (PSI), dedicated to wafer reclaim, wafer thinning and MEMS mid-end process services, plans to set up a new plant to fulfill robust orders from international ...
ExtremeTech

TSMC Announces New System-on-Wafer Process With 3D-Stacking

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DRAM Wafer Market to Reach USD 18.56 Billion by 2031 Driven by Memory Density and Fab Yield Optimization | Valuates Reports

The global market for DRAM Wafer was valued at USD 12360 Million in the year 2024 and is projected to reach a revised size of USD 18560 Million by 2031, growing at a CAGR of 6.0% during the forecast ...