Image transfer, also known as photolithography (or simply, lithography), plays a crucial role in defining the circuit patterns on a panel. With photolithography, IC substrate manufacturers can ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

As demand for high-speed transmission in AI advanced packaging surges, IC substrate major Unimicron Technology said that high ...

Cuts carbon dioxide emissions from its production by 50%—equivalent to planting 1.3 million trees annually. Boosts durability by up to three times for secure information recognition even with ...

The semiconductor is a highly integrated device that cannot be connected directly to the main board in the way that condensers or resistors can. Therefore, a packaging substrate (or intermediary layer ...

SiP packaging is the next big thing, or not Analysts at iConnect are warning that while the IC substrate market in 2015 should be happy at the rise of wearables,… SiP packaging is the next big thing, ...