Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

Artificial intelligence (AI) is no longer a research concept — it is the economic engine driving infrastructure investment worldwide. The growth of AI data centers, powered by high-performance CPUs, ...

Fabric might be the last thing on your mind when firefighters rescue someone from a burning building, but without fire-resistant clothing, such rescues might not happen at all. The turnout gear that ...

The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...

The Xe-100 is a 200MWt Advanced Pebble Bed Reactor that will be deployed in Washington State in the 2028 timeframe with the support of the US DOE Advanced Reactor Demonstration Program. The Xe-100 has ...

Kaynes Semicon Pvt. Ltd., a flagship OSAT initiative of Kaynes Technology India Ltd., today announced its strategic adoption of Synopsys' engineering simulation software through the Ansys Channel ...

Thermal management has long been a key challenge facing design engineers. For decades, engineers have faced trying to dissipate heat from densely packed electronics that have continued to shrink in ...

In a nutshell: For more than half a century, the relentless progress of Moore's Law has driven engineers to double the number of transistors on a chip approximately every two years, fueling ...