MATERIALS: Master Bond Inc’s Master Bond EP21FL is a two-part epoxy resin system that features low to moderate viscosity. It is well-suited for potting, coating and sealing electronic assemblies and ...

Master Bond is a leading manufacturer of epoxy adhesives, sealants, coatings, potting and encapsulation compounds, formulated to meet the rigorous needs of the electronics industry. Master Bond’s wide ...

The epoxy has a forgiving cure ratio which can be varied for more rigidity or better impact resistance. EP21LV two-part epoxy conforms to USP Class VI and Title 21, U.S. Code of Federal Regulations, ...

December 19, 2025 - Hackensack, NJ - Master Bond Supreme 10HTLV is a one part, non-frozen, heat cured epoxy formulated for demanding structural bonding applications. This toughened system features a ...

The rigid, impact-resistant epoxy maintains dimensions over a wide temperature range. EP30R aramid-fiber-reinforced, two-part epoxy adhesive bonds metals, glass, ceramics, vulcanized rubbers and many ...

Master Bond has developed a highly thermally conductive epoxy system that is specially designed to help mitigate the issues associated with tightly packed components and miniaturized electronic ...

Master Bond EP54TC is a two-component epoxy engineered for heat sink bonding and thermal management applications where efficient heat transfer is critical. Featuring the highest thermal conductivity ...

Master Bond EP3HTSDA-2Med is a true one component epoxy that is not pre-mixed and frozen. It offers an easy dispensing profile with an exceptionally long working life at room temperature, making it ...

The Master Bond EP21TDC-4 is a room temperature curing two part epoxy system that features high peel strength. This highly flexible epoxy is intended for high performance bonding, sealing and coating ...

The FL901S is a one component, silver conductive epoxy film and preform system made specifically to provide high performance bonding and sealing. This system cures very quickly at moderately elevated ...