Add Yahoo as a preferred source to see more of our stories on Google. Imagine trying to carve a tiny, complex sculpture into a block the size of your fingernail again ...
A team of physicists has uncovered some of the physics that make possible the etching of silicon computer chips, which power cell phones, computers, and a huge range of electronic devices. Physicist ...
Mass spectrometry, by contrast, is a powerful technique for the analysis of any process gas. Careful consideration of differences in pressure, reaction time scales and process flow is essential for ...
Plasma etching and atomic layer etching (ALE) constitute essential techniques in the fabrication of next‐generation nanoscale devices. Plasma etching utilises ionised gases to selectively remove ...
Plasma chemistry and etching processes form the backbone of modern semiconductor fabrication, enabling the precise patterning and removal of material layers essential to device performance. By ...
A large-scale (4-inch), highly uniform, and defect-free plasma etching technology, which will likely become the foundation of the industrial supply of molybdenum disulfide (MoS₂), a next-generation ...
In this interview, AZoM talks to Bas Derksema about advancements in plasma etching and deposition processes for compound semiconductor materials applications. Please could you introduce yourself and ...
DRESDEN, Germany--(BUSINESS WIRE)--Rain, darkness, the dazzling lights of an oncoming car - strong light reflection in such situations can be irritating or even become dangerous. Effective ...
Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor packaging, targeting applications in dry descum, ashing, surface preparation ...
Development of next-generation power devices is needed for energy saving in a low carbon society. Diamond is a potentially important power device material due to its excellent physical and electronic ...
Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor packaging, targeting applications in dry descum, ashing, surface preparation ...
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